Thermal Conductive Compounds / Silicone Thermal Pastes
Thermally conductive pastes (or silicone-based thermal compounds) are materials designed to improve heat transfer between two surfaces, typically between an electronic component and a heat sink.
Their main characteristics include the ability to fill micro-irregularities by eliminating air gaps (which act as thermal insulators), long-term stability, electrical insulation properties and easy application thanks to their paste-like or creamy consistency.
| SILICONS | SPECIFIC GRAVITY (g/cm3) | VISCOSITY (mPas) | POT LIFE (min) | HARDNESS (Shore A) | THERMAL CONDUCTIVITY (W/mK) | COLOR |
|---|---|---|---|---|---|---|
| THERMOSIL 140 | 2,2 | PASTE | REMAINS AT ITS ORIGINAL CONSISTENCY | 0,9 | WHITE | |
| COMPOSTO 340 | 2,2 | PASTE | REMAINS AT ITS ORIGINAL CONSISTENCY | 0,41 | WHITE | |
| APPLICATION: Silicone pastes for the protection of electronic boards, thermal gaskets, probes and resistors. | ||||||
