Silicone Encapsulation Resins

Silicone Encapsulation Resins

The new silicone-based product family further expands GPS Co.’s range of two-component resins and adhesives. Designed for extreme applications, these products offer outstanding tear resistance, making them suitable for the aerospace industry and other highly demanding sectors. Exceptional thermal resistance, high dielectric strength and flame resistance are among the key properties of this product range.
SILICONS SPECIFIC GRAVITY (g/cm3) VISCOSITY (mPas) POT LIFE (min) HARDNESS (Shore A) THERMAL CONDUCTIVITY (W/mK) COLOR
PLASTOSIL 80 0,9 THIXOTROPIC 35 24 0,5 BLACK
RS 55 SH 0,9 8000 15 52 0,25 TRANSPARENT
RS 7252 1,4 6000 10 / 15 MINUTES 41 0,37 LIGHT BLUE
APPLICATION: Used as protective compounds, for filling electronic component housings, for encapsulation of connectors, sensors and electronic board components, and for mould manufacturing where good tear resistance is required. Also used in the aerospace industry for thermal insulation and fire protection.